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Faculty of Electrical Engineering and Information Technology

Atomic Layer Deposition System

Within this project an atomic layer deposition (ALD) system will be purchased that is capable to handle substrates with a diameter of up to 200 mm. The ALD system will be used to deposit functional (e.g. multiferroic or memristive) oxides and nitrides, and catalytically active metals. These materials will be integral parts in novel electronic devices and circuits for application in information technology, photonics, micro-fluidics, and micro- and nanotechnology. ALD is the only technology that provides the specific deposition properties (including precise control of thickness and stoichiometry, conformal deposition, and low deposition temperature and energy) required to perform the planned cutting-edge research projects.

The ALD system will be used to deposit functional (e.g. multiferroic or memristive) oxides and nitrides, and catalytically active metals. These materials will be integral parts in novel electronic devices and circuits for application in information technology, photonics, micro-fluidics, and micro- and nanotechnology. ALD is the only technology that provides the specific deposition properties (including precise control of thickness and stoichiometry, conformal deposition, and low deposition temperature and energy) required to perform the planned cutting-edge research projects.

Prinzip der ALD © LS MNE ​/​ TU Dortmund

DFG Major Research Instrumentation Art. 91b GG

  •     Titel: Atomic Layer Deposition System
  •     Project Number: 471301649
  •     Project Duration: Since 2022
  •     Funding: 50 % DFG, 40 % State NRW, 10 % TU Dortmund University
Ministry Culture and Science of the State of North Rhine-Westphalia